ESD Anti Static Bag for Packing PC board / Computer Main Board

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ESD Anti Static Bag for Packing PC board / Computer Main Board

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ESD Anti Static Bag for Packing PC board / Computer Main Board

 

Description:

1. Available in three –layer or four-layer structure; material:PET / VMPET / anti-static PE, PET/anti-static PE

2. Firm lamination and hot sealing offers superior resistance of vapor and oxygen ;

3. Protect your expensive electronics from moisture and static damage ;

4. In flat open top style , Both printing and non-printing;Up to 10 color of gravure printing,withvivid printingeffect.

5. Being opaque and light tight, it ensures the inside item can not been seen from outside ;

6. Surface e resistance of108—1011Ω;

7. Applicable to pack electronic products which are sensitive to moisture and static, such as PC board, IC integrated circuit , CD driver , HD etc.

8. Professional service;

9. Free sample for spout pouch;

No.

Item

Unit

Test standard and index

1

Metal layer resistance

ohm/sq

<100

2

Metal layer optical transmission

Optical density

40%-0.4 optical density

3

Surface resistivity

Ohm/sq

<1010

4

Time for static removal

5000-0V

<0.01 Sec. FTMS 101 B Method 4046

5

Friction static

E1A541 Appendix C

TriboelectricNanocouIombs

Avg.

Quartz<13n/in Tefion.<13n/in

6

Capacitance release

Voltage difference -E1A541

<10V

7

Anti-erosion

FTMS 101 C

No visible spots FTMS 101 C Method 3005

8

Tensile strength

Ibs./in

ASTM D882 >18

9

Tear initiation

Ibs./in

ASTM D1004 >2.5

10

Puncture resistance

P.S.I

ASTM D3420 >100

11

Tear resistance

Ibs./in

ASTM D882 > 8

12

MVTR

gm/100in-2/24hrs

ASTM E 96 <0.2

13

Oxygen barrier

CC/100in-2/24hrs

ASTM D 3985 <0.5

14

Heat seal temperature

F

250-375F

15

Heat seal pressure

P.S.I

30-70

16

breaking tensile force N/15mm

N/15mm

GB/96-04-10

17

Breaking elongation

%

GB/96-04-10

18

Size

GB/96-04-10

Thickness ±10%; length ±3 mm; width ±2 mm

19

Appearance

GB/96-04-10

No delamination, burst seal, wrinkle, warp, break, foreign particle adherence, air bubble beyond sealing diameter≤3mm


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