Daily Archives: 2017年3月10日

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Plastic Cold Runner Injection Molding , Portable Computer Plastic Injection Moulding Parts

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Cold Runner Plastic Injection Mold , Portable Computer Plastic Injection Moulding Parts

  1. PP, PC, PS, PE, PU, PVC, ABS, PMMA ect
  2. for Electrical parts, Medical treatments, Bathroom plastic accessories, Telecommunication devices, Toys and Crafts: One stop tooling room and injection center.
  3. Hot/cold runner

Description:

Name Portable Computer Plastic Injection Mould
Mould material 45#, 50#, P20, H13, 718, 2738, NAK80, S136, SKD61 etc.
Mould base LKM, HASCO ect
Cavity according customer’s request
Runner Hot/cold
Design software UG, PROE, CAD, CAXA ect.
Plastic material PP, PC, PS, PE, PU, PVC, ABS, PMMA ect
Mould life 300,000-3,000,000 shots
Delivery time 15-60days
Specification Depends on customer’s requirements.

Applications:

This product will be widely used on the LED lighting industry, the plastic material is it is a very precise mould and the struction is complicated, highly required standard on the surface treatment and texture.


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Computer IC Chips ICS9LPR600DGLF computer mainboard chips

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ICS9LPR600DGLF is a computer mainboard chips.

 

Place of Origin: Malaysia Brand Name: ICS Model Number: ICS9LPR600DGLF computer mainboard chips
Type: IC Application: Computer TYPES: ELECTRONIC

 

Over View

 

The Northbridge typically handles communications among the CPU, in some cases RAM, and PCI Express (or AGP) video cards, and the Sourthbridge. Some Northbridges also contain integrated video controllers, also known as aGraphics and Memory Controller Hub(GMCH) in Intel systems. Because different processors and RAM require different signaling, a given Northbridge will typically work with only one or two classes of CPUs and generally only one type of RAM.

There are a few chipsets that support two types of RAM (generally these are available when there is a shift to a new standard). For example, the Northbridge from the Nvidia nForce2 chipset will only work with Socket A processors combined with DDR SDRAM; the Intel i875 chipset will only work with systems using Pentium 4 processors or Celeron processors that have a clock speed greater than 1.3 GHz and utilize DDR SDRAM, and the Intel i915g chipset only works with the Intel Pentium 4 and the Celeron, but it can use DDR or DDR2 memory.


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ESD Anti Static Bag for Packing PC board / Computer Main Board

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ESD Anti Static Bag for Packing PC board / Computer Main Board

 

Description:

1. Available in three –layer or four-layer structure; material:PET / VMPET / anti-static PE, PET/anti-static PE

2. Firm lamination and hot sealing offers superior resistance of vapor and oxygen ;

3. Protect your expensive electronics from moisture and static damage ;

4. In flat open top style , Both printing and non-printing;Up to 10 color of gravure printing,withvivid printingeffect.

5. Being opaque and light tight, it ensures the inside item can not been seen from outside ;

6. Surface e resistance of108—1011Ω;

7. Applicable to pack electronic products which are sensitive to moisture and static, such as PC board, IC integrated circuit , CD driver , HD etc.

8. Professional service;

9. Free sample for spout pouch;

No.

Item

Unit

Test standard and index

1

Metal layer resistance

ohm/sq

<100

2

Metal layer optical transmission

Optical density

40%-0.4 optical density

3

Surface resistivity

Ohm/sq

<1010

4

Time for static removal

5000-0V

<0.01 Sec. FTMS 101 B Method 4046

5

Friction static

E1A541 Appendix C

TriboelectricNanocouIombs

Avg.

Quartz<13n/in Tefion.<13n/in

6

Capacitance release

Voltage difference -E1A541

<10V

7

Anti-erosion

FTMS 101 C

No visible spots FTMS 101 C Method 3005

8

Tensile strength

Ibs./in

ASTM D882 >18

9

Tear initiation

Ibs./in

ASTM D1004 >2.5

10

Puncture resistance

P.S.I

ASTM D3420 >100

11

Tear resistance

Ibs./in

ASTM D882 > 8

12

MVTR

gm/100in-2/24hrs

ASTM E 96 <0.2

13

Oxygen barrier

CC/100in-2/24hrs

ASTM D 3985 <0.5

14

Heat seal temperature

F

250-375F

15

Heat seal pressure

P.S.I

30-70

16

breaking tensile force N/15mm

N/15mm

GB/96-04-10

17

Breaking elongation

%

GB/96-04-10

18

Size

GB/96-04-10

Thickness ±10%; length ±3 mm; width ±2 mm

19

Appearance

GB/96-04-10

No delamination, burst seal, wrinkle, warp, break, foreign particle adherence, air bubble beyond sealing diameter≤3mm